2026年第九届智能材料应用国际会议 (ICSMA 2026)

时间: 2026-01-19 09:00 至 2026-01-21 18:00

地址: 日本.东京

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简介会议背景

Welcome to the official website of 2026 the 9th International Conference on Smart Materials Applications (ICSMA 2026). The Conference will be held at Tokyo University of Science, Tokyo, Japan during January 19-21, 2026. ICSMA2026 is co-organized by South Asia Institute of Science and Engineering (SAISE); Tokyo University of Science, Japan; Yonsei University, South Korea and Sichuan University, China. The conference program covered invited, oral, and poster presentations from scientists working in similar areas to establish platforms for collaborative research projects in this field. This conference will bring together leaders from industry and academia to exchange and share their experiences, present research results, explore collaborations and to spark new ideas, with the aim of developing new projects and exploiting new technology in this field.

联系联系方式

刘女士

电子邮箱:icsma@saise.org


大会组委大会组委

Conference Committee Chairs

Prof. Kazuo Umemura, Tokyo University of Science, Japan 

Prof. Jong Hak Kim, Yonsei University, South Korea 

Prof. Xiaohong Zhu, Sichuan University, China 

Program Committee Chairs

Assoc. Prof. Jung Tae Park, Yonsei University, South Korea 

Assoc. Prof. Teik-Cheng Lim, Singapore University of Social Sciences, Singapore 

Dr. Seok-Keun Koh, C&G Hitech Co., Ltd, Korea 

Publicity Committees

Assoc. Prof. Prakash Jadhav, SRM University-AP, India 

Dr. Amnat Jarerat, Mahidol University, Thailand 

Dr. Hoo Peng Yong, Universiti Malaysia Perlis, Malaysia 

Technical Committee Members

Prof. Ahmed M Al-Jumaily, Auckland University of Technology, New Zealand
Prof. Hassan Shokry, Advanced Technology and New Materials Research Institute, Egypt
Prof. ZURUZI Abu Samah, Alfaisal University, Kingdom of Saudi Arabia
Prof. Patrick Townsend, 4ESPOL, Guayaquil, Ecuador
Prof. Paul Huanca-Zuñiga, Universidad Nacional de San Agustín de Arequipa, Peru
Prof. Sutanu Samanta, North Eastern Regional Institute of Science and Technology (NERIST), India
Assoc. Prof. Kowit Piyamongkala, King Mongkut’s University of Technology North Bangkok, Thailand
Assoc. Prof. Punnama Siriphannon, King Mongkut's Institute of Technology Ladkrabang, Thailand
Assoc. Prof. Rinlee Butch Cervera, University of the Philippines Diliman, Philippines
Assoc. Prof. Bashir Ahmmad Arima, Yamagata University, Japan
Assoc. Prof. Il Jeon, Sungkyunkwan university advanced institute of Nano Technology (SAINT), South Korea
Assoc. Prof. Sergey Inozemtcev, National Research Moscow State University of Civil Engineering, Russia
Assoc. Prof. Tomáš Homola, Masaryk University, Czech Republic
Assoc. Prof. Ivana Plazonić, University of Zagreb, Croatia
Assoc. Prof. Irena Bates, University of Zagreb, Croatia
Asst. Prof. Peng Hao Wang, Purdue University, USA
Asst Prof. Ratchadaporn Puntharod, Maejo University, Thailand
Asst. Prof. Nabam Teyi, North Eastern Regional Institute of Science and Technology (NERIST), India
Dr. Nattakan Soykeabkaew, Mae Fah Luang University, Thailand
Dr. Suchart Chantaramanee, Rajamangala, University of Technology Srivijaya, Thailand
Dr. Juhyeong Lee, Utah State University, USA
Dr. Norie Allafi Akeel, Sohar University, Sultanate of Oman
Dr. Anh Vu Nguyen, Viettel Aerospace Institute, Vietnam
Chong Woon Chan, Universiti Tunku Abdul Rahman, Malaysia 


简介投稿须知

请按照出版社要求的格式写作并登录ICSMA2026官方投稿链接投稿 http://confsys.iconf.org/submission/icsma2026

投稿要求:

每篇论文应不少于5页,包括所有图表和参考文献。


报名须知报名须知

网站
http://www.icsma.org/

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征稿主题征稿主题

1. Smart & Functional Materials

  • Smart Materials

  • Multifunctional Materials

  • Nanomaterials

  • Biomaterials

  • Magnetic Materials, Hard/Soft, Spintronics

  • Superconducting Materials

  • Thin Film Photovoltaics, Coatings

  • Amorphous Materials

2. Material Properties & Characterization

  • Mechanical: Fatigue, Fracture, Creep, Wear

  • Electrical & Magnetic Properties

  • Corrosion, Erosion, Toxicity

  • Non-Destructive Testing

  • Reliability Assessment

 

3. Manufacturing & Processing

  • Additive Manufacturing, Rapid Prototyping

  • Coatings, Surface Treatment

  • Powder Metallurgy, Sintering

  • Heat Treatment, Thermo-Chemical Treatment

  • Cleaner Production Methods

  • Robotics, Mechatronics

4. Computational & AI-Driven Approaches

  • Multiscale Modeling

  • Computational Materials Science

  • AI, Expert Systems

  • Materials Databases

  • Techniques, Process Simulation

5. Applications & Sustainability

  • Electronics, Photovoltaics

  • Large-Scale Infrastructure

  • Supply Chain, LCA